TPS7101Q datasheet(3/41 Pages) TI2

3 / 41 page

TPS7101Q, TPS7133Q, TPS7148Q, TPS7150Q

TPS7101Y, TPS7133Y, TPS7148Y, TPS7150Y

LOW-DROPOUT VOLTAGE REGULATORS

SLVS092G – NOVEMBER 1994 – REVISED JANUARY 2003

POST OFFICE BOX 655303

• DALLAS, TEXAS 75265

† TPS7133, TPS7148, TPS7150 (fixed-voltage options)

‡ Capacitor selection is nontrivial. See application information section

for details.

SENSE

OUT

GND

0.1

µF

CSR

µF

TPS71xx†

CO‡

Figure 2. Typical Application Configuration

TPS71xx chip information

These chips, when properly assembled, display characteristics similar to the TPS71xxQ. Thermal compression

or ultrasonic bonding may be used on the doped aluminum bonding pads. The chips may be mounted with

conductive epoxy or a gold-silicon preform.

(6)

(4)

(3)

(7)

(2)

(1)

GND

FB¶

OUT

TPS71xx

CHIP THICKNESS: 15 MILS TYPICAL

BONDING PADS: 4

× 4 MILS MINIMUM

TJmax = 150°C

TOLERANCES ARE

±10%.

ALL DIMENSIONS ARE IN MILS.

(6)

(7)

(2)

(5)

(4)

(3)

(1)

§ SENSE – Fixed voltage options only (TPS7133, TPS7148,

and TPS7150)

¶ FB – Adjustable version only (TPS7101)

BONDING PAD ASSIGNMENTS

SENSE§

(5)

NOTE A: For most applications, OUT and SENSE should

be tied together as close as possible to the device;

for other implementations, refer to SENSE-pin

connection

discussion

the

Applications

Information section of this data sheet.

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