PACKAGE OPTION ADDENDUM

www.ti.com

29-May-2025

PACKAGING INFORMATION

Orderable part number

Status

(1)

Material type

(2)

Package | Pins

Package qty | Carrier

RoHS

(3)

Lead finish/

Ball material

(4)

MSL rating/

Peak reflow

(5)

Op temp (°C)

Part marking

(6)

5962-8974001RA

Active

Production

CDIP (J) | 20

20 | TUBE

No

SNPB

N/A for Pkg Type

-55 to 125

5962-8974001RA

CD54HCT640F3A

CD54HC640F3A

Active

Production

CDIP (J) | 20

20 | TUBE

No

SNPB

N/A for Pkg Type

-55 to 125

5962-8780901RA

CD54HC640F3A

CD54HC640F3A.A

Active

Production

CDIP (J) | 20

20 | TUBE

No

SNPB

N/A for Pkg Type

-55 to 125

5962-8780901RA

CD54HC640F3A

CD54HCT640F3A

Active

Production

CDIP (J) | 20

20 | TUBE

No

SNPB

N/A for Pkg Type

-55 to 125

5962-8974001RA

CD54HCT640F3A

CD54HCT640F3A.A

Active

Production

CDIP (J) | 20

20 | TUBE

No

SNPB

N/A for Pkg Type

-55 to 125

5962-8974001RA

CD54HCT640F3A

CD74HC640E

Active

Production

PDIP (N) | 20

20 | TUBE

Yes

NIPDAU

N/A for Pkg Type

-55 to 125

CD74HC640E

CD74HC640E.A

Active

Production

PDIP (N) | 20

20 | TUBE

Yes

NIPDAU

N/A for Pkg Type

-55 to 125

CD74HC640E

CD74HC640M

Active

Production

SOIC (DW) | 20

25 | TUBE

Yes

NIPDAU

Level-1-260C-UNLIM

-55 to 125

HC640M

CD74HC640M.A

Active

Production

SOIC (DW) | 20

25 | TUBE

Yes

NIPDAU

Level-1-260C-UNLIM

-55 to 125

HC640M

CD74HCT640E

Active

Production

PDIP (N) | 20

20 | TUBE

Yes

NIPDAU | NIPDAU

N/A for Pkg Type

-55 to 125

CD74HCT640E

CD74HCT640E.A

Active

Production

PDIP (N) | 20

20 | TUBE

Yes

NIPDAU

N/A for Pkg Type

-55 to 125

CD74HCT640E

CD74HCT640M

Active

Production

SOIC (DW) | 20

25 | TUBE

Yes

NIPDAU

Level-1-260C-UNLIM

-55 to 125

HCT640M

CD74HCT640M.A

Active

Production

SOIC (DW) | 20

25 | TUBE

Yes

NIPDAU

Level-1-260C-UNLIM

-55 to 125

HCT640M

(1) Status: For more details on status, see our product life cycle.

(2) Material type: When designated, preproduction parts are prototypes/experimental devices, and are not yet approved or released for full production. Testing and final process, including without limitation quality assurance,

reliability performance testing, and/or process qualification, may not yet be complete, and this item is subject to further changes or possible discontinuation. If available for ordering, purchases will be subject to an additional

waiver at checkout, and are intended for early internal evaluation purposes only. These items are sold without warranties of any kind.

(3) RoHS values: Yes, No, RoHS Exempt. See the TI RoHS Statement for additional information and value definition.

(4) Lead finish/Ball material: Parts may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two lines if the finish value exceeds the maximum

column width.

(5) MSL rating/Peak reflow: The moisture sensitivity level ratings and peak solder (reflow) temperatures. In the event that a part has multiple moisture sensitivity ratings, only the lowest level per JEDEC standards is shown.

Refer to the shipping label for the actual reflow temperature that will be used to mount the part to the printed circuit board.

Addendum-Page 1