2

LM5035C

SNVS631D – JANUARY 2010 – REVISED OCTOBER 2016

www.ti.com

Product Folder Links: LM5035C

Submit Documentation Feedback

Copyright © 2010–2016, Texas Instruments Incorporated

Table of Contents

1

Features .................................................................. 1

2

Applications ........................................................... 1

3

Description ............................................................. 1

4

Revision History..................................................... 2

5

Device Comparison Table..................................... 3

6

Pin Configuration and Functions ......................... 4

7

Specifications......................................................... 6

7.1

Absolute Maximum Ratings ...................................... 6

7.2

ESD Ratings.............................................................. 6

7.3

Recommended Operating Conditions ....................... 6

7.4

Thermal Information .................................................. 6

7.5

Electrical Characteristics........................................... 7

7.6

Typical Characteristics ............................................ 10

8

Detailed Description ............................................ 12

8.1

Overview ................................................................. 12

8.2

Functional Block Diagram ....................................... 13

8.3

Feature Description................................................. 14

8.4

Device Functional Modes........................................ 20

9

Application and Implementation ........................ 21

9.1

Application Information............................................ 21

9.2

Typical Application .................................................. 21

10

Power Supply Recommendations ..................... 33

11

Layout................................................................... 33

11.1

Layout Guidelines ................................................. 33

11.2

Layout Example .................................................... 34

12

Device and Documentation Support ................. 35

12.1

Documentation Support ....................................... 35

12.2

Receiving Notification of Documentation Updates 35

12.3

Community Resource............................................ 35

12.4

Trademarks ........................................................... 35

12.5

Electrostatic Discharge Caution ............................ 35

12.6

Glossary ................................................................ 35

13

Mechanical, Packaging, and Orderable

Information ........................................................... 35

4 Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from Revision C (March 2013) to Revision D

Page

•

Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation

section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and

Mechanical, Packaging, and Orderable Information section ................................................................................................. 1

•

Changed HBM value from ±2000 to ±1500 in the ESD Ratings table ................................................................................... 6

•

Changed thermal values in the Thermal Information table to align with JEDEC standards................................................... 6

•

Deleted THERMAL RESISTANCE section from the Electrical Characteristics table ............................................................. 9

Changes from Revision B (March 2013) to Revision C

Page

•

Changed layout of National Semiconductor Data Sheet to TI format .................................................................................. 22