LMV793, LMV794

SNOSAX6D – MARCH 2007 – REVISED MARCH 2013

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These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

Absolute Maximum Ratings

(1) (2)

Human Body Model

2000V

ESD Tolerance(3)

Machine Model

200V

Charge-Device Model

1000V

VIN Differential

±0.3V

Supply Voltage (V+ – V−)

6.0V

Input/Output Pin Voltage

V+ +0.3V, V−

−0.3V

Storage Temperature Range

−65°C to 150°C

Junction Temperature(4)

+150°C

Infrared or Convection (20 sec)

235°C

Soldering Information

Wave Soldering Lead Temp (10 sec)

260°C

(1)

Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for

which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test

conditions, see the Electrical Characteristics Tables.

(2)

If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and

specifications.

(3)

Human Body Model, applicable std. MIL-STD-883, Method 3015.7. Machine Model, applicable std. JESD22-A115-A (ESD MM std. of

JEDEC)Field-Induced Charge-Device Model, applicable std. JESD22-C101-C (ESD FICDM std. of JEDEC).

(4)

The maximum power dissipation is a function of TJ(MAX), θJA. The maximum allowable power dissipation at any ambient temperature is

PD = (TJ(MAX) - TA)/θJA. All numbers apply for packages soldered directly onto a PC Board.

Operating Ratings

(1)

Temperature Range(2)

−40°C to 125°C

−40°C ≤ TA ≤ 125°C

2.0V to 5.5V

Supply Voltage (V+ – V−)

0°C

≤ TA ≤ 125°C

1.8V to 5.5V

5-Pin SOT-23

180°C/W

Package Thermal Resistance (

θJA

(2))

8-Pin SOIC

190°C/W

8-Pin VSSOP

236°C/W

(1)

Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for

which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test

conditions, see the Electrical Characteristics Tables.

(2)

The maximum power dissipation is a function of TJ(MAX), θJA. The maximum allowable power dissipation at any ambient temperature is

PD = (TJ(MAX) - TA)/θJA. All numbers apply for packages soldered directly onto a PC Board.

2.5V Electrical Characteristics

(1)

Unless otherwise specified, all limits are specified for TA = 25°C, V

+ = 2.5V, V− = 0V, V

CM = V

+/2 = V

O. Boldface limits apply

at the temperature extremes.

Symbol

Parameter

Conditions

Min

Typ

Max

Units

(2)

(3)

(2)

VOS

Input Offset Voltage

0.1

±1.35

mV

±1.65

TC VOS Input Offset Voltage Temperature Drift

(4)

LMV793

−1.0

μV/°C

LMV794

−1.8

(1)

Electrical Table values apply only for factory testing conditions at the temperature indicated. Factory testing conditions result in very

limited self-heating of the device such that TJ = TA. No specification of parametric performance is indicated in the electrical tables under

conditions of internal self-heating where TJ > TA.

(2)

Limits are 100% production tested at 25°C. Limits over the operating temperature range are specified through correlations using the

statistical quality control (SQC) method.

(3)

Typical values represent the most likely parametric norm as determined at the time of characterization. Actual typical values may vary

over time and will also depend on the application and configuration. The typical values are not tested and are not ensured on shipped

production material.

(4)

Offset voltage average drift is determined by dividing the change in VOS by temperature change.

2

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