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AMC3301 Datasheet(PDF) 25 Page - Texas Instruments |
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AMC3301 Datasheet(HTML) 25 Page - Texas Instruments |
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25 / 38 page ![]() 7.3 Best Design Practices Do not leave the analog inputs INP and INN of the AMC3301 unconnected (floating) when the device is powered up. If the device inputs are left floating, the input bias current may drive the inputs to a positive value that exceeds the operating common-mode input voltage and the output of the device is undetermined. Connect the negative input (INN) to the high-side ground (HGND), either by a hard short or through a resistive path. A DC current path between INN and HGND is required to define the input common-mode voltage. Take care not to exceed the input common-mode range as specified in the Recommended Operating Conditions table. For best accuracy, route the ground connection as a separate trace that connects directly to the shunt resistor rather than shorting AGND to INN directly at the input to the device. See the Layout section for more details. The high-side LDO can source a limited amount of current (IH) to power external circuitry. Take care not to overload the high-side LDO. The low-side LDO does not output a constant voltage and is not intended for powering any external circuitry. Do not connect any external load to the LDO_OUT pin. 7.4 Power Supply Recommendations The AMC3301 is powered from the low-side power supply (VDD) with a nominal value of 3.3 V or 5 V. TI recommends a low-ESR decoupling capacitor of 1 nF (C8 in Figure 7-5) placed as close as possible to the VDD pin, followed by a 1-µF capacitor (C9) to filter this power-supply path. The low-side of the DC/DC converter is decoupled with a low-ESR 100-nF capacitor (C4) positioned close to the device between the DCDC_IN and DCDC_GND pins. Use a 1-µF capacitor (C2) to decouple the high side in addition to a low-ESR, 1-nF capacitor (C3) placed as close as possible to the device and connected to the DCDC_OUT and DCDC_HGND pins. For the high-side LDO, use low-ESR capacitors of 1 nF (C6), placed as close as possible to the AMC3301, followed by a 100-nF decoupling capacitor (C5). The ground reference for the high-side (HGND) is derived from the terminal of the shunt resistor which is connected to the negative input (INN) of the device. For best DC accuracy, use a separate trace to make this connection instead of shorting HGND to INN directly at the device input. The high-side DC/DC ground terminal (DCDC_HGND) is shorted to HGND directly at the device pins. C2 1 µF C6 1 nF C5 100 nF C3 1 nF C1 100 nF R2 10 R4 10 C10 10 nF I FB1 FB2 FB3 DCDC_OUT DCDC_HGND HLDO_IN HLDO_OUT HGND INP INN NC AMC3301 C9 1 µF C8 1 nF C4 100 nF R1 47 k DCDC_IN LDO_OUT VDD OUTP OUTN GND DIAG DCDC_GND 3.3 V / 5 V supply to uC (optional) to RC filter / ADC to RC filter / ADC Figure 7-5. Decoupling the AMC3301 Capacitors must provide adequate effective capacitance under the applicable DC bias conditions they experience in the application. Multilayer ceramic capacitors (MLCC) typically exhibit only a fraction of their nominal capacitance under real-world conditions and this factor must be taken into consideration when selecting these capacitors. This problem is especially acute in low-profile capacitors, in which the dielectric field strength is www.ti.com AMC3301 SBAS917C – AUGUST 2019 – REVISED MAY 2025 Copyright © 2025 Texas Instruments Incorporated Submit Document Feedback 25 Product Folder Links: AMC3301 |
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