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AMC3301 Datasheet(PDF) 25 Page - Texas Instruments

Part # AMC3301
Description  AMC3301 Precision, ±250mV Input, Reinforced Isolated Amplifier With Integrated DC/DC Converter
PDF  38 Pages
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Manufacturer  TI2 [Texas Instruments]
Direct Link  https://www.ti.com
Logo TI2 - Texas Instruments

AMC3301 Datasheet(HTML) 25 Page - Texas Instruments

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7.3 Best Design Practices
Do not leave the analog inputs INP and INN of the AMC3301 unconnected (floating) when the device is powered
up. If the device inputs are left floating, the input bias current may drive the inputs to a positive value that
exceeds the operating common-mode input voltage and the output of the device is undetermined.
Connect the negative input (INN) to the high-side ground (HGND), either by a hard short or through a resistive
path. A DC current path between INN and HGND is required to define the input common-mode voltage. Take
care not to exceed the input common-mode range as specified in the Recommended Operating Conditions table.
For best accuracy, route the ground connection as a separate trace that connects directly to the shunt resistor
rather than shorting AGND to INN directly at the input to the device. See the Layout section for more details.
The high-side LDO can source a limited amount of current (IH) to power external circuitry. Take care not to
overload the high-side LDO.
The low-side LDO does not output a constant voltage and is not intended for powering any external circuitry. Do
not connect any external load to the LDO_OUT pin.
7.4 Power Supply Recommendations
The AMC3301 is powered from the low-side power supply (VDD) with a nominal value of 3.3 V or 5 V. TI
recommends a low-ESR decoupling capacitor of 1 nF (C8 in Figure 7-5) placed as close as possible to the VDD
pin, followed by a 1-µF capacitor (C9) to filter this power-supply path.
The low-side of the DC/DC converter is decoupled with a low-ESR 100-nF capacitor (C4) positioned close to
the device between the DCDC_IN and DCDC_GND pins. Use a 1-µF capacitor (C2) to decouple the high side
in addition to a low-ESR, 1-nF capacitor (C3) placed as close as possible to the device and connected to the
DCDC_OUT and DCDC_HGND pins.
For the high-side LDO, use low-ESR capacitors of 1 nF (C6), placed as close as possible to the AMC3301,
followed by a 100-nF decoupling capacitor (C5).
The ground reference for the high-side (HGND) is derived from the terminal of the shunt resistor which is
connected to the negative input (INN) of the device. For best DC accuracy, use a separate trace to make this
connection instead of shorting HGND to INN directly at the device input. The high-side DC/DC ground terminal
(DCDC_HGND) is shorted to HGND directly at the device pins.
C2 1 µF
C6 1 nF
C5 100 nF
C3 1 nF
C1 100 nF
R2 10
R4 10
C10 10 nF
I
FB1
FB2
FB3
DCDC_OUT
DCDC_HGND
HLDO_IN
HLDO_OUT
HGND
INP
INN
NC
AMC3301
C9
1 µF
C8
1 nF
C4
100 nF
R1
47 k
DCDC_IN
LDO_OUT
VDD
OUTP
OUTN
GND
DIAG
DCDC_GND
3.3 V / 5 V supply
to uC (optional)
to RC filter / ADC
to RC filter / ADC
Figure 7-5. Decoupling the AMC3301
Capacitors must provide adequate effective capacitance under the applicable DC bias conditions they
experience in the application. Multilayer ceramic capacitors (MLCC) typically exhibit only a fraction of their
nominal capacitance under real-world conditions and this factor must be taken into consideration when selecting
these capacitors. This problem is especially acute in low-profile capacitors, in which the dielectric field strength is
www.ti.com
AMC3301
SBAS917C – AUGUST 2019 – REVISED MAY 2025
Copyright © 2025 Texas Instruments Incorporated
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