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PACKAGE OUTLINE

C

SEE TERMINAL

DETAIL

24X

0.3

0.2

2.45 0.1

24X

0.5

0.3

1 MAX

(0.2) TYP

0.05

0.00

20X 0.5

2X

2.5

2X 2.5

A

4.1

3.9

B

4.1

3.9

0.3

0.2

0.5

0.3

VQFN - 1 mm max height

RGE0024B

PLASTIC QUAD FLATPACK - NO LEAD

4219013/A 05/2017

PIN 1 INDEX AREA

0.08 C

SEATING PLANE

1

6

13

18

7

12

24

19

(OPTIONAL)

PIN 1 ID

0.1

C A B

0.05

EXPOSED

THERMAL PAD

25

SYMM

SYMM

NOTES:

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing

per ASME Y14.5M.

2. This drawing is subject to change without notice.

3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance.

SCALE 3.000

DETAIL

OPTIONAL TERMINAL

TYPICAL