5 Specifications

5.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

VCC

Supply voltage

-0.5

7

V

IIK

Input clamp diode current

For VI < 0.5V or VI > VCC + 0.5V

±20

mA

IOK

Output clamp diode current

For VO < -0.5V or VO > VCC + 0.5V

±20

mA

IO

Output source or sink current per output

pin

For VO > -0.5V or VO < VCC + 0.5V

±25

mA

Continuous current through VCC or GND

±50

mA

TJ

Junction temperature

150

°C

Tstg

Storage temperature range

-65

150

°C

Lead temperature (Soldering 10s) (SOIC - Lead Tips Only)

300

°C

(1)

Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings

only and functional operation of the device at these or any other conditions beyond those indicated under recommended operating

conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

5.2 Recommended Operating Conditions

MIN

MAX

UNIT

VCC

Supply voltage range

HC types

2

6

V

HCT types

4.5

5.5

VI

Input voltage

0

VCC

V

VO

Output voltage

0

VCC

V

tt

Input rise and fall time

VCC = 2V

1000

ns

VCC = 4.5V

500

VCC = 6V

400

TA

Temperature range

-55

125

°C

5.3 Thermal Information

THERMAL METRIC

CD74HC(T)138, CD74HC(T)238

UNIT

N

(PDIP)

D

(SOIC)

NS

(SOP)

PW

(TSSOP)

16 Pins

16 Pins

16 Pins

16 Pins

RθJA

Junction-to-ambient thermal

resistance(1)

67

73

64

108

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC package thermal metrics application

report.

CD54HC138, CD74HC138, CD54HCT138, CD74HCT138, CD54HC238, CD74HC238, CD54HCT238,

CD74HCT238

SCHS147J – NOVEMBER 1998 – REVISED NOVEMBER 2021

www.ti.com

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