DRV8833

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SLVSAR1E – JANUARY 2011 – REVISED JULY 2015

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

VM

Power supply voltage

–0.3

11.8

V

Digital input pin voltage

–0.5

7

V

xISEN pin voltage

–0.3

0.5

V

Peak motor drive output current

Internally limited

A

TJ

Operating junction temperature

–40

150

°C

Tstg

Storage temperature

–60

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

6.2 ESD Ratings

VALUE

UNIT

Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1)

±4000

Electrostatic

V(ESD)

V

Charged device model (CDM), per JEDEC specification JESD22-C101, all

discharge

±1500

pins(2)

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

TA = 25°C (unless otherwise noted)

MIN

NOM

MAX

UNIT

VM

Motor power supply voltage range(1)

2.7

10.8

V

VDIGIN

Digital input pin voltage range

–0.3

5.75

V

IOUT

RTY package continuous RMS or DC output current per bridge(2)

1.5

A

(1)

RDS(ON) increases and maximum output current is reduced at VM supply voltages below 5 V.

(2)

VM = 5 V, power dissipation and thermal limits must be observed.

6.4 Thermal Information

DRV8833

PWP

RTY

PW

THERMAL METRIC(1)

UNIT

(HTSSOP)

(WQFN)

(TSSOP)

16 PINS

16 PINS

16 PINS

RθJA

Junction-to-ambient thermal resistance

40.5

37.2

103.1

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

32.9

34.3

38

°C/W

RθJB

Junction-to-board thermal resistance

28.8

15.3

48.1

°C/W

ψJT

Junction-to-top characterization parameter

0.6

0.3

3

°C/W

ψJB

Junction-to-board characterization parameter

11.5

15.4

47.5

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

4.8

3.5

N/A

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

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