Package and PCB thermal data

L5300GJ

18/26

DS6145 Rev 8

4

Package and PCB thermal data

Figure 28. PowerSSO-12 PC board(1)

1.

Layout condition of Rth and Zth measurements (PCB: double layer, thermal vias,

FR4 area = 77 mm x 86 mm, PCB thickness = 1.6 mm, Cu thickness = 70 µm (front and back side), thermal

vias separation 1.2 mm, thermal via diameter 0.3 mm +/- 0.08 mm, Cu thickness on vias 0.025 mm,

Footprint dimension 4.1 mm x 6.5 mm ).

Figure 29. Rthj-amb Vs. PCB copper area in open box free air condition

40

45

50

55

60

65

70

75

02

46

8

10

RTHj _amb( ° C/ W)

PCB Cu heat sink area ( cm^ 2)