PESDXV4UF_G_W_3

© NXP B.V. 2008. All rights reserved.

Product data sheet

Rev. 03 — 28 January 2008

11 of 16

NXP Semiconductors

PESDxV4UF/G/W

Very low capacitance quadruple ESD protection diode arrays

9.

Packing information

[1]

For further information and the availability of packing methods, see Section 13.

[2]

T1: normal taping

[3]

T4: 90

° rotated reverse taping

[4]

T2: reverse taping

10. Soldering

Table 10.

Packing methods

The indicated -xxx are the last three digits of the 12NC ordering code.[1]

Type number

Package

Description

Packing quantity

3000

4000

5000

8000

10000

PESD3V3V4UF

SOT886

4 mm pitch, 8 mm tape and reel; T1

[2] -

-

-115

-

-

4 mm pitch, 8 mm tape and reel; T4

[3] -

-

-132

-

-

PESD5V0V4UF

SOT886

4 mm pitch, 8 mm tape and reel; T1

[2] -

-

-115

-

-

4 mm pitch, 8 mm tape and reel; T4

[3] -

-

-132

-

-

PESD3V3V4UG

SOT353

4 mm pitch, 8 mm tape and reel; T1

[2] -115

-

-

-

-135

4 mm pitch, 8 mm tape and reel; T2

[4] -125

-

-

-

-165

PESD5V0V4UG

SOT353

4 mm pitch, 8 mm tape and reel; T1

[2] -115

-

-

-

-135

4 mm pitch, 8 mm tape and reel; T2

[4] -125

-

-

-

-165

PESD3V3V4UW

SOT665

2 mm pitch, 8 mm tape and reel

-

-

-

-315

-

4 mm pitch, 8 mm tape and reel

-

-115

-

-

-

PESD5V0V4UW

SOT665

2 mm pitch, 8 mm tape and reel

-

-

-

-315

-

4 mm pitch, 8 mm tape and reel

-

-115

-

-

-

Reflow soldering is the only recommended soldering method.

Fig 13. Reflow soldering footprint PESDxV4UF (SOT886)

sot886_fr

solder lands

occupied area

solder paste

Dimensions in mm

0.425

(6

×)

1.250

0.675

1.700

0.325

(6

×)

0.270

(6

×)

0.370

(6

×)

0.500

0.500