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DP83867CS Datasheet(PDF) 114 Page - Texas Instruments

Part # DP83867CS
Description  DP83867E/IS/CS Robust, High Immunity, Small Form Factor 10/100/1000 Ethernet Physical Layer Transceiver
PDF  129 Pages
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Manufacturer  TI2 [Texas Instruments]
Direct Link  https://www.ti.com
Logo TI2 - Texas Instruments

DP83867CS Datasheet(HTML) 114 Page - Texas Instruments

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Figure 8-10. Avoiding Stubs in a Differential Signal Pair
Signals on different layers must not cross each other without at least one return path plane between them.
Coupling between traces is also an important factor. Unwanted coupling can cause cross talk problems.
Differential pairs must have a constant coupling distance between them.
For convenience and efficient layout process, start by routing the critical signals first.
8.4.1.2 Return Path
A general best practice is to have a solid return path beneath all signal traces. This return path can be a
continuous ground or DC power plane. Reducing the width of the return path width can potentially affect the
impedance of the signal trace. This effect is more prominent when the width of the return path is comparable to
the width of the signal trace. Breaks in return path beneath the signal traces can be avoided at all cost. A signal
crossing a plane split can cause unpredictable return path currents and can likely impact signal quality as well,
potentially creating EMI problems. See Figure 8-11
Figure 8-11. Differential Signal Pair-Plane Crossing
8.4.1.3 Transformer Layout
There can be no metal layer running beneath the transformer. Transformers can inject noise in metal beneath
them which can affect the performance of the system.
8.4.1.4 Metal Pour
All metal pours which are not signals or power can be tied to ground. There can be no floating metal on the
system. There can be no metal between the differential traces.
DP83867CS, DP83867IS, DP83867E
SNLS504F – OCTOBER 2015 – REVISED JANUARY 2025
www.ti.com
114
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Product Folder Links: DP83867CS DP83867IS DP83867E



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