DP83867CS datasheet(117/129 Pages) TI2

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9 Device and Documentation Support

9.1 Documentation Support

Note

TI is transitioning to use more inclusive terminology. Some language can be different than what you

can expect to see for certain technology areas.

9.1.1 Related Documentation

For related documentation, see the following:

• Texas Instruments, DP83867 Troubleshooting Guide

• Texas Instruments, How to Configure DP838XX for Ethernet Compliance Testing application note

• Texas Instruments, Configuring Ethernet Devices with 4-Level Straps application note

• Texas Instruments, RGMII Interface Timing Budgets application note

• Texas Instruments, DP83867E/IS/CS/IR/CR RGZ Power Consumption Data application note

• Texas Instruments, How to Configure DP83867 Start of Frame application note

9.2 Receiving Notification of Documentation Updates

To receive notification of documentation updates, navigate to the device product folder on ti.com. Click on

Notifications to register and receive a weekly digest of any product information that has changed. For change

details, review the revision history included in any revised document.

9.3 Support Resources

TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight

from the experts. Search existing answers or ask your own question to get the quick design help you need.

Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do

not necessarily reflect TI's views; see TI's Terms of Use.

9.4 Trademarks

TI E2E™ is a trademark of Texas Instruments.

All trademarks are the property of their respective owners.

9.5 Electrostatic Discharge Caution

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled

with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may

be more susceptible to damage because very small parametric changes could cause the device not to meet its published

specifications.

9.6 Glossary

TI Glossary

This glossary lists and explains terms, acronyms, and definitions.

10 Revision History

Changes from Revision E (February 2024) to Revision F (December 2024)

Page

• Updated JTAG_CLK description.........................................................................................................................4

• Added clarity to BMSR Register's MF Preamble Suppression description.......................................................45

Changes from Revision D (November 2022) to Revision E (February 2024)

Page

• Add SGMII output section...................................................................................................................................9

www.ti.com

DP83867CS, DP83867IS, DP83867E

SNLS504F – OCTOBER 2015 – REVISED JANUARY 2025

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