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DP83867CS Datasheet(PDF) 126 Page - Texas Instruments |
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DP83867CS Datasheet(HTML) 126 Page - Texas Instruments |
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126 / 129 page  www.ti.com PACKAGE OUTLINE C 48X 0.30 0.18 4.1 0.1 48X 0.5 0.3 1 MAX (0.2) TYP 0.05 0.00 44X 0.5 2X 5.5 2X 5.5 B 7.15 6.85 A 7.15 6.85 VQFN - 1 mm max height RGZ0048B PLASTIC QUAD FLATPACK - NO LEAD 4218795/B 02/2017 PIN 1 INDEX AREA 0.08 C SEATING PLANE 1 12 25 36 13 24 48 37 (OPTIONAL) PIN 1 ID 0.1 C B A 0.05 EXPOSED THERMAL PAD 49 SYMM SYMM NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance. SCALE 2.000 |
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