6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)

MIN

MAX

UNIT

Supply Voltage, VDD

–0.3

6

V

Input voltage, VI

SDA, SCL, IN+, IN–, FB

–0.3

VDD + 0.3

V

Boost voltage

BST, SW, OUT+, OUT–, PVDD

–0.3

120

V

Operating free-air temperature, TA

–40

70

°C

Operating junction temperature, TJ

–40

150

°C

Storage temperature, Tstg

–65

85

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress

ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under

Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device

reliability.

6.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic discharge

Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

±2500

V

Charged device model (CDM), per JEDEC specification JESD22-

C101(2)

±500

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM MAX

UNIT

VDD

Supply voltage

3.3

5.5

V

VBST Boost voltage

15

105

V

VIN

Differential input voltage

1.8

V

CL

Load capacitance

VBST = 105 V, Frequency = 500 Hz, VOUT = 200 VPP

50

nF

VBST = 105 V, Frequency = 300 Hz, VOUT = 200 VPP

100

VBST = 80 V, Frequency = 300 Hz, VOUT = 150 VPP

150

VBST = 55 V, Frequency = 300 Hz, VOUT = 100 VPP

330

VBST = 30 V, Frequency = 300 Hz, VOUT = 50 VPP

680

VBST = 25 V, Frequency = 300 Hz, VOUT = 40 VPP

1000

VBST = 15 V, Frequency = 300 Hz, VOUT = 20 VPP

3000

REXT Current limit control resistor

6

35

kΩ

L

Inductance for boost converter

3.3

µH

6.4 Thermal Information

THERMAL METRIC(1)

DRV2665

UNIT

RGP (QFN)

20 PINS

RθJA

Junction-to-ambient thermal resistance

32.6

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

30.4

°C/W

RθJB

Junction-to-board thermal resistance

8.2

°C/W

ψJT

Junction-to-top characterization parameter

0.4

°C/W

ψJB

Junction-to-board characterization parameter

8.1

°C/W

DRV2665

SLOS740C – MAY 2012 – REVISED JANUARY 2023

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