4

LF198-N, LF298, LF398-N

LF198A-N, LF398A-N

SNOSBI3C – JULY 2000 – REVISED OCTOBER 2018

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Product Folder Links: LF198-N LF298 LF398-N LF198A-N LF398A-N

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Copyright © 2000–2018, Texas Instruments Incorporated

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

If Military/Aerospace specified devices are required, please contact the TI Sales Office/ Distributors for availability and specifications.

(3)

The maximum power dissipation must be derated at elevated temperatures and is dictated by TJMAX, RθJA, and the ambient temperature,

TA. The maximum allowable power dissipation at any temperature is PD = (TJMAX − TA) / RθJA, or the number given in the Absolute

Maximum Ratings, whichever is lower. The maximum junction temperature, TJMAX, for the LF198-N and LF198A-N is 150°C; for the

LF298, 115°C; and for the LF398-N and LF398A-N, 100°C.

(4)

Although the differential voltage may not exceed the limits given, the common-mode voltage on the logic pins may be equal to the

supply voltages without causing damage to the circuit. For proper logic operation, however, one of the logic pins must always be at least

2 V below the positive supply and 3 V above the negative supply.

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1) (2)

MIN

MAX

UNIT

Supply voltage

±18

V

Power dissipation

(Package limitation, see (3))

500

mW

Operating ambient temperature

LF198-N, LF198A-N

–55

125

°C

LF298

–25

85

°C

LF398-N, LF398A-N

0

70

°C

Input voltage

±18

V

Logic-to-logic reference differential voltage (see (4))

7

−30

V

Output short circuit duration

Indefinite

Hold capacitor short circuit duration

10

sec

Lead temperature

H package (soldering, 10 sec.)

260

°C

N package (soldering, 10 sec.)

260

°C

M package: vapor phase (60 sec.)

215

°C

Infrared (15 sec.)

220

°C

Storage temperature, Tstg

–65

150

°C

6.2 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

Supply voltage

±15

V

TJ

Ambient temperature

LF198-N, LF198A-N

–55

125

°C

LF298

–25

85

LF398-N, LF398A-N

0

70

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

(2)

Board mount in 400 LF/min air flow.

6.3 Thermal Information

THERMAL METRIC(1)

LF398-N

LF298, LF398-N

LFx98x

UNIT

P (PDIP)

D (SOIC)

LMC (TO-99)

8 PINS

14 PINS

8 PINS

RθJA

Junction-to-ambient thermal resistance

48.9

80.6

85(2)

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

37.3

38.1

20

°C/W

RθJB

Junction-to-board thermal resistance

26.2

35.4

—

°C/W

ψJT

Junction-to-top characterization parameter

14.3

5.8

—

°C/W

ψJB

Junction-to-board characterization parameter

26.0

35.1

—

°C/W