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STPA002 Datasheet(PDF) 20 Page - STMicroelectronics |
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STPA002 Datasheet(HTML) 20 Page - STMicroelectronics |
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20 / 24 page ![]() General information STPA002 20/24 DocID024368 Rev 3 5.5 Heat sink definition Assuming we have a dissipated power of 26 W (e.g. in the worst case situation of frequent clipping occurrence, with music signal), considering Tj max is 150 °C and assuming ambient temperature is 70 °C, the available temperature gap for a correct dissipation is 80 °C. This means the thermal resistance of the system Rth has to be 80 °C/26 W = 3 °C/W. The junction to case thermal resistance is 1 °C/W. So the heat sink thermal resistance should be approximately 2 °C/W. This would avoid any thermal shutdown occurrence even after long-term and full-volume operation. |
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