© 2002 Fairchild Semiconductor Corporation

www.fairchildsemi.com

BC556 / BC557 / BC558 / BC559 / BC560 Rev. 1.7

2

Absolute Maximum Ratings

Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be opera-

ble above the recommended operating conditions and stressing the parts to these levels is not recommended. In addi-

tion, extended exposure to stresses above the recommended operating conditions may affect device reliability. The

absolute maximum ratings are stress ratings only. Values are at TA = 25°C unless otherwise noted.

Thermal Characteristics(1)

Values are at TA = 25°C unless otherwise noted.

Note:

1. PCB size: FR-4, 76 mm x 114 mm x 1.57 mm (3.0 inch x 4.5 inch x 0.062 inch) with minimum land pattern size.

Symbol

Parameter

Value

Unit

VCBO

Collector-Base Voltage

BC556

-80

V

BC557 / BC560

-50

BC558 / BC559

-30

VCEO

Collector-Emitter Voltage

BC556

-65

V

BC557 / BC560

-45

BC558 / BC559

-30

VEBO

Emitter-Base Voltage

-5

V

IC

Collector Current (DC)

-100

mA

ICP

Peak Collector Current (Pulse)

-200

mA

IBP

Peak Base Current (Pulse)

-200

mA

TJ

Junction Temperature

150

°C

TSTG

Storage Temperature Range

-65 to +150

°C

Symbol

Parameter

Max.

Unit

PD

Total Power Dissipation

500

mW

Derate Above 25

°C4.0

mW/

°C

RθJA

Thermal Resistance, Junction-to-Ambient

250

°C/W