MF-USMF Series - PTC Resettable Fuses

Specifications are subject to change without notice.

Users should verify actual device performance in their specific applications.

The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf.

Solder Reflow Recommendations

TP

TP

tp

t s

TTO

RAMP-UP

L

TL

t L

25

Ts max

Ts min

PREHEAT

Time

CRITICAL ZONE

RAMP-DOWN

t 25 °C TO PEAK

Notes:

•

MF-USMF models are intended for reflow soldering (including, but not

limited to heating plate, hot air, IR, nitrogen, and vapor phase).

•

Wave soldering is permissible only if the device is on the top of the

PCB, opposite the heat source.

•

Hand soldering is not recommended for these devices.

•

All temperatures refer to the topside of the device, measured on the

device body surface.

•

If reflow temperatures exceed the recommended profile, devices may

not meet the published specifications.

•

Compatible with Pb and Pb-free solder reflow profiles.

•

Excess solder may cause a short circuit.

•

Please refer to the Multifuse® Polymer PTC Resettable Fuse Soldering

Recommendations for more details.

Profile Feature

Pb-Free Assembly

Average Ramp-Up Rate (Tsmax to Tp)

3 °C / second max.

PREHEAT:

Temperature Min. (Tsmin)

Temperature Max. (Tsmax)

Time (Tsmin to Tsmax) (ts)

150 °C

200 °C

60~180 seconds

TIME MAINTAINED ABOVE:

Temperature (TL)

Time (tL)

217 °C

60~150 seconds

Peak Temperature (Tp)

260 °C

Time within 5 °C of Actual Peak Temperature (tp)

20~40 seconds

Ramp-Down Rate

6 °C / second max.

Time 25 °C to Peak Temperature

8 minutes max.