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STPS2L60 Datasheet(PDF) 5 Page - STMicroelectronics |
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STPS2L60 Datasheet(HTML) 5 Page - STMicroelectronics |
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5 / 15 page ![]() Figure 11. Thermal resistance junction to ambient versus copper surface under each lead (SMA) 0 50 100 150 200 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 R (°C/W) th(j-a) SMA S(Cu)(cm²) Epoxy printed circuit board FR4, copper thickness: 35 µm Figure 12. Thermal resistance versus lead length (DO-41) Rth(°C/W) 0 20 40 60 80 100 120 5 10 15 25 Lleads(mm) Rth(j-I) Rth(j-a) 20 Figure 13. Thermal resistance junction to ambient versus copper surface under each lead (SMB Flat) 0 50 100 150 200 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 SCu(cm²) Rth(j-a) (°C/W) SMB-Flat Epoxy printed circuit board FR4, eCu= 35 µm Figure 14. Thermal resistance junction to ambient versus copper surface under each lead (SMA Flat Notch) 0 50 100 150 200 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 R (°C/W) th(j-a) S(Cu)(cm²) Epoxy printed circuit board FR4, copper thickness: 35 µm SMA Flat Notch STPS2L60 Characteristics (curves) DS2976 - Rev 8 page 5/15 |
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