Figure 5. Reverse leakage current versus reverse voltage

applied (typical values)

0

5

10

15

20

25

30

35

40

45

50

55

60

1E -3

1E -2

1E -1

1E +0

1E +1

5E +1

=25°C

=75°C

=100°C

=125°C

Tj =150°C

=50°C

IR(mA)

VR(V)

Tj

Tj

Tj

Tj

Tj

Figure 6. Junction capacitance versus reverse voltage

applied (typical values)

1

10

100

10

20

50

100

200

500

C( pF)

F= 1 MHz

Tj = 25 °C

VR(V)

Figure 7. Forward voltage drop versus forward current

(low level)

0. 0

0.1

0. 2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1. 0

0. 0

0. 5

1. 0

1. 5

2. 0

2. 5

3. 0

3. 5

4. 0

4. 5

5. 0

Tj = 25°C

Tj = 125°C

Tj = 150°C

(typical values)

IF(A)

VF(V)

(Maximum values)

(Maximum values)

Figure 8. Forward voltage drop versus forward current

(high level)

0.2

0.4

0.6

0.8

1.0

1.2

1.4

1.6

1

2

5

10

20

Tj = 25°C (Maximum values)

Tj = 125°C (Maximum values)

Tj = 150°C

(typical values)

IF(A)

VF(V)

Figure 9. Thermal resistance junction to ambient versus copper surface under each lead (Epoxy printed

circuit board FR4, eCu: 35 μm)

0

20

40

60

80

100

120

140

160

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

4.5

5.0

SCu(cm²)

Rth(j-a) (°C/W)

SMC

STPS3L60S

Characteristics (curves)

DS1596 - Rev 3

page 4/9