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STPS5L60 Datasheet(PDF) 6 Page - STMicroelectronics |
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STPS5L60 Datasheet(HTML) 6 Page - STMicroelectronics |
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6 / 16 page ![]() Figure 13. Thermal resistance junction to ambient versus copper surface under each lead (SMC) 0 20 40 60 80 100 120 140 160 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 Rth(j-a) (°C/W) SCu(cm²) SMC Epoxy p ri nted ci rcuit board FR4, coppe r t hickness: 35 µm Figure 14. Thermal resistance versus lead length 0 10 20 30 40 50 60 70 80 90 5 10 15 20 25 Rth(°C/W) R th(j - a) Rth(j-l) DO-201AD Lleads (mm) STPS5L60 Characteristics (curves) DS2741 - Rev 5 page 6/16 |
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