6.4 Thermal Information: OPA145

THERMAL METRIC(1)

OPA145

UNIT

D (SOIC)

DGK (VSSOP)

DBV (SOT)

8 PINS

8 PINS

5 PINS

RθJA

Junction-to-ambient thermal resistance

136

143

205

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

74

47

200

°C/W

RθJB

Junction-to-board thermal resistance

62

64

113

°C/W

ΨJT

Junction-to-top characterization parameter

19.7

5.3

38.2

°C/W

ΨJB

Junction-to-board characterization parameter

54.8

62.8

104.9

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

N/A

N/A

N/A

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

6.5 Thermal Information: OPA2145

THERMAL METRIC(1)

OPA2145

UNIT

D (SOIC)

DGK (VSSOP)

8 PINS

8 PINS

RθJA

Junction-to-ambient thermal resistance

118.7

163.9

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

52.3

53.4

°C/W

RθJB

Junction-to-board thermal resistance

63.5

85.0

°C/W

ΨJT

Junction-to-top characterization parameter

10.7

5.9

°C/W

ΨJB

Junction-to-board characterization parameter

62.4

83.7

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

N/A

N/A

°C/W

(1)

For more information about traditional and new thermal metrics, seethe Semiconductorand IC Package Thermal Metrics application

report.

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OPA145, OPA2145

SBOS427F – JUNE 2017 – REVISED MARCH 2021

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