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OPA277UA/2K5 Datasheet(PDF) 7 Page - Texas Instruments

Part # OPA277UA/2K5
Description  OPAx277 High-Precision Operational Amplifiers
PDF  43 Pages
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Manufacturer  TI2 [Texas Instruments]
Direct Link  https://www.ti.com
Logo TI2 - Texas Instruments

OPA277UA/2K5 Datasheet(HTML) 7 Page - Texas Instruments

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6.4 Thermal Information: OPA277
THERMAL METRIC(1)
OPA277
UNIT
D (SOIC)
DRM (VSON)
P (PDIP)
8 PINS
8 PINS
8 PINS
RθJA
Junction-to-ambient thermal resistance
110.1
40.7
49.2
°C/W
RθJC(top)
Junction-to-case(top) thermal resistance
52.2
41.3
39.4
°C/W
RθJB
Junction-to-board thermal resistance
52.3
16.7
26.4
°C/W
ψJT
Junction-to-top characterization parameter
10.4
0.6
15.4
°C/W
ψJB
Junction-to-board characterization parameter
51.5
16.9
26.3
°C/W
RθJC(bot)
Junction-to-case(bottom) thermal resistance
N/A
3.3
N/A
°C/W
(1)
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report
6.5 Thermal Information: OPA2277
THERMAL METRIC(1)
OPA2277
UNIT
D (SOIC)
DRM (VSON)
P (PDIP)
8 PINS
8 PINS
8 PINS
RθJA
Junction-to-ambient thermal resistance
126.9
39.3
47.2
°C/W
RθJC(top)
Junction-to-case(top) thermal resistance
67.1
36.9
36.0
°C/W
RθJB
Junction-to-board thermal resistance
70.3
15.4
24.4
°C/W
ψJT
Junction-to-top characterization parameter
18.8
0.4
13.4
°C/W
ψJB
Junction-to-board characterization parameter
69.5
15.6
24.3
°C/W
RθJC(bot)
Junction-to-case(bottom) thermal resistance
N/A
2.2
N/A
°C/W
(1)
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report
6.6 Thermal Information: OPA4277
THERMAL METRIC(1)
OPA4277
UNIT
D (SOIC)
P (PDIP)
14 PINS
14 PINS
RθJA
Junction-to-ambient thermal resistance
86.5
66.3
°C/W
RθJC(top)
Junction-to-case(top) thermal resistance
38.5
20.5
°C/W
RθJB
Junction-to-board thermal resistance
43.5
26.8
°C/W
ψJT
Junction-to-top characterization parameter
7.4
2.1
°C/W
ψJB
Junction-to-board characterization parameter
42.9
26.2
°C/W
RθJC(bot)
Junction-to-case(bottom) thermal resistance
N/A
N/A
°C/W
(1)
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report
www.ti.com
OPA277, OPA2277, OPA4277
SBOS079C – MARCH 1999 – REVISED FEBRUARY 2023
Copyright © 2023 Texas Instruments Incorporated
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Product Folder Links: OPA277 OPA2277 OPA4277



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