OPA836IDBVT datasheet(8/66 Pages) TI2

8 / 66 page

7 Specifications

7.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)

MIN

MAX

UNIT

VS– to VS+

Supply voltage

5.5

Input voltage

VS– – 0.7

VS+ + 0.7

VID

Differential input voltage

Continuous input current

0.85

Continuous output current

Continuous power dissipation

See Section 7.4

and

Section 7.5

Maximum junction temperature

150

°C

Operating free-air temperature

–40

125

°C

Tstg

Storage temperature

–65

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress

ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under

Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device

reliability.

7.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic discharge

Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

±6000

Charged-device model (CDM), per JEDEC specification JESD22-C101(2)

±1000

Machine model

±200

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

VS+

Single supply voltage

2.5

5.5

Ambient temperature

–40

125

°C

7.4 Thermal Information: OPA836

THERMAL METRIC(1)

OPA836

UNIT

DBV (SOT23-6) RUN (WQFN-10)

6 PINS

10 PINS

RθJA

Junction-to-ambient thermal resistance

194

145.8

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

129.2

75.1

°C/W

RθJB

Junction-to-board thermal resistance

39.4

38.9

°C/W

ψJT

Junction-to-top characterization parameter

25.6

13.5

°C/W

ψJB

Junction-to-board characterization parameter

38.9

104.5

°C/W

(1)

For more information about traditional and new thermal metrics, see Semiconductor and IC Package Thermal Metrics (SPRA953).

OPA836, OPA2836

SLOS712J – JANUARY 2011 – REVISED MARCH 2021

www.ti.com

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