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STPS340AFN Datasheet(PDF) 15 Page - STMicroelectronics |
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STPS340AFN Datasheet(HTML) 15 Page - STMicroelectronics |
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15 / 19 page ![]() 2.5 DPAK package information • Epoxy meets UL 94,V0 • Cooling method: by conduction (C) Figure 25. DPAK package outline L1 L A1 R R D c A c2 V2 A2 H L4 e1 e b L2 E b4 Gauge plane 0.25 D1 E1 Thermal pad Note: This package drawing may slightly differ from the physical package. However, all the specified dimensions are guaranteed. STPS340 DPAK package information DS0792 - Rev 13 page 15/19 |
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