Characteristics

FERD30H100S

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DocID029159 Rev 2

Figure 7: Thermal resistance junction to ambient versus copper surface under tab for DPAK (typical values)

0

10

20

30

40

50

60

70

80

0

5

10

15

20

25

30

35

40

SCu(cm²)

Rth(j-a) (°C/W)

DPAK

Epoxy printed board FR4, eCu= 35 µm

90

100