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SN54HC03 Datasheet(PDF) 4 Page - Texas Instruments

Part # SN54HC03
Description  SNx4HC03 Quadruple 2-Input NAND Gates with Open-Drain Outputs
PDF  33 Pages
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Manufacturer  TI2 [Texas Instruments]
Direct Link  https://www.ti.com
Logo TI2 - Texas Instruments

SN54HC03 Datasheet(HTML) 4 Page - Texas Instruments

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5 Specifications
5.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)(1)
MIN
MAX
UNIT
VCC
Supply voltage
–0.5
7
V
IIK
Input clamp current(2)
VI < 0 or VI > VCC
±20
mA
IOK
Output clamp current(2)
VO < 0 or VO > VCC
±20
mA
IO
Continuous output current
VO = 0 to VCC
±25
mA
Continuous current through VCC or GND
±50
mA
TJ
Junction temperature(3)
150
°C
Tstg
Storage temperature
–65
150
°C
(1)
Stresses beyond those listed under Absolute Maximum Rating may cause permanent damage to the device. These are stress
ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated
under Recommended Operating Condition. Exposure to absolute-maximum-rated conditions for extended periods may affect device
reliability.
(2)
The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
(3)
Guaranteed by design.
5.2 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN
NOM
MAX
UNIT
VCC
Supply voltage
2
5
6
V
VIH
High-level input voltage
VCC = 2 V
1.5
V
VCC = 4.5 V
3.15
VCC = 6 V
4.2
VIL
Low-level input voltage
VCC = 2 V
0.5
V
VCC = 4.5 V
1.35
VCC = 6 V
1.8
VI
Input voltage
0
VCC
V
VO
Output voltage
0
VCC
V
Δt/Δv
Input transition rise and fall rate
VCC = 2 V
1000
ns
VCC = 4.5 V
500
VCC = 6 V
400
TA
Operating free-air temperature
SN54HC03
–55
125
°C
SN74HC03
–40
85
5.3 Thermal Information
THERMAL METRIC(1)
SN74HC03
UNIT
D (SOIC)
N (PDIP)
NS (SOP)
PW (TSSOP)
14 PINS
14 PINS
14 PINS
14 PINS
RθJA
Junction-to-ambient thermal
resistance
133.6
66.0
122.6
151.7
°C/W
RθJC(top)
Junction-to-case (top) thermal
resistance
89
53.7
81.8
79.4
°C/W
RθJB
Junction-to-board thermal
resistance
89.5
45.7
83.8
94.7
°C/W
ΨJT
Junction-to-top characterization
parameter
45.5
33.3
45.4
25.2
°C/W
SN54HC03, SN74HC03
SCLS077F – MARCH 1984 – REVISED APRIL 2021
www.ti.com
4
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Product Folder Links: SN54HC03 SN74HC03



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