1A

1Y

1

6

2A2

Y

3

4

SN74LVC2G17

SCES381N – JANUARY 2002 – REVISED JANUARY 2015

www.ti.com

9 Detailed Description

9.1 Overview

NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the

package.

This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs,

preventing damaging current backflow through the device when it is powered down.

9.2 Functional Block Diagram

9.3 Feature Description

•

1.65 V to 5.5 V operating voltage range

•

Allows down voltage translation

–

5 V to 3.3 V

–

5 V or 3.3 V to 1.8 V

•

Inputs accept voltages to 5.5 V

–

5-V tolerance on input pin

•

Ioff feature

–

Allows voltage on the inputs and outputs when VCC is 0 V

–

Able to reduce leakage when VCC is 0 V

•

Schmitt-Trigger Input can improve the noise immunity capability

9.4 Device Functional Modes

INPUT

OUTPUT

A

Y

H

H

L

L

8

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