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UCC28056CDBVT Datasheet(PDF) 6 Page - Texas Instruments |
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UCC28056CDBVT Datasheet(HTML) 6 Page - Texas Instruments |
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6 / 55 page ![]() 6 UCC28056 SLUSD37E – OCTOBER 2017 – REVISED NOVEMBER 2019 www.ti.com Product Folder Links: UCC28056 Submit Documentation Feedback Copyright © 2017–2019, Texas Instruments Incorporated (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. 7 Specifications 7.1 Absolute Maximum Ratings Over operating free-air temperature range (unless otherwise noted) (1) MIN MAX UNIT Input voltage VCC -0.5 36 V ZCD/CS -0.5 7 VOSNS -0.5 7 Output voltage COMP -0.5 7 V DRV -0.3 20 Junction temperature range TJ -40 150 °C Storage temperature range, Tstg Tstg -65 150 Lead temperature Soldering, 10 second 300 Reflow 260 (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 7.2 ESD Ratings VALUE UNIT V(ESD) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1) ±2000 V Charged device model (CDM), per JEDEC specification JESD22-C101, all pins(2) ±500 7.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN NOM MAX UNIT VCC Input voltage 12 V TA Operating ambient temperature -40 125 °C (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953. 7.4 Thermal Information THERMAL METRIC(1) UCC28056 UNIT SOT23-6 6 PINS RΘJA Junction-to-ambient thermal resistance 116.4 °C/W RΘJC(top) Junction-to-case (top) thermal resistance 74.9 °C/W RΘJB Junction-to-board thermal resistance 36.1 °C/W ΨJT Junction-to-top characterization parameter 18.8 °C/W ΨJB Junction-to-board characterization parameter 36.0 °C/W |
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