PACKAGE OUTLINE

4224850/C 06/2025

www.ti.com

HTQFP - 1.2 mm max height

PLASTIC QUAD FLATPACK

PHD0064B

A

B

0.2

C A B

NOTES:

1.

All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing

per ASME Y14.5M.

2. This drawing is subject to change without notice.

3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed

0.15 per side.

4. See technical brief. PowerPad Thermally Enhanced Package, Texas Instruments Literature No. SLMA002

(www.ti.com/lit/slma002) and SLMA004 (www.ti.com/lit/slma004) for information regarding recommended board layout.

PIN 1

INDEX AREA

48

33

17

32

16

1

SEATING PLANE

C

SEE DETAIL A

49

64

0°-7°

0.25

GAGE PLANE

0.1 C

1.05

0.95

60 X 0.8

4 X 12

(0.127) TYP

1.2 MAX

17

16

1

32

33

48

64

49

DETAIL A

TYPICAL

0.75

0.45

THERMAL PAD

NOTE 4

8.00

6.68

14.05

13.95

NOTE 3

14.05

13.95

NOTE 3

8.00

6.68

16.15

15.85

TYP

64 X 0.40

0.30

0.15

0.05