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TAS5613APHDR Datasheet(PDF) 21 Page - Texas Instruments

Part # TAS5613APHDR
Description  150W STEREO / 300W MONO PurePath™ HD ANALOG-INPUT POWER STAGE
PDF  33 Pages
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Manufacturer  TI2 [Texas Instruments]
Direct Link  https://www.ti.com
Logo TI2 - Texas Instruments

TAS5613APHDR Datasheet(HTML) 21 Page - Texas Instruments

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TAS5613A
www.ti.com
SLAS711B
– JUNE 2010 – REVISED SEPTEMBER 2011
OSCILLATOR
The oscillator frequency can be trimmed by external control of the FREQ_ADJ pin.
To reduce interference problems while using radio receiver tuned within the AM band, the switching frequency
can be changed from nominal to lower values. These values should be chosen such that the nominal and the
lower value switching frequencies together results in the fewest cases of interference throughout the AM band.
can be selected by the value of the FREQ_ADJ resistor connected to AGND in master mode.
For slave mode operation, turn of the oscillator by pulling the FREQ_ADJ pin to VREG. This configures the
OSC_I/O pins as inputs and needs to be slaved from an external differential clock.
PRINTED CIRCUIT BOARD RECOMMENDATION
Use an unbroken ground plane to have good low impedance and inductance return path to the power supply for
power and audio signals. PCB layout, audio performance and EMI are linked closely together. The circuit
contains high fast switching currents; therefore, care must be taken to prevent damaging voltage spikes. Routing
the audio input should be kept short and together with the accompanied audio source ground. A local ground
area underneath the device is important to keep solid to minimize ground bounce.
Netlist for this printed circuit board is generated from the schematic in Figure 12.
Note T1: PVDD decoupling bulk capacitors C60-C64 should be as close as possible to the PVDD and GND_X pins,
the heat sink sets the distance. Wide traces should be routed on the top layer with direct connection to the pins and
without going through vias. No vias or traces should be blocking the current path.
Note T2: Close decoupling of PVDD with low impedance X7R ceramic capacitors is placed under the heat sink and
close to the pins.
Note T3: Heat sink needs to have a good connection to PCB ground.
Note T4: Output filter capacitors must be linear in the applied voltage range preferable metal film types.
Figure 14. Printed Circuit Board - Top Layer
Copyright
© 2010–2011, Texas Instruments Incorporated
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Product Folder Link(s): TAS5613A



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