Extruded

Heat Sinks

All other products, please contact factory for price, delivery, and minimums.

Normally stocked

50

EXTRUDED HEAT SINKS FOR POWER SEMICONDUCTORS

621 AND 623 SERIES

Low-Profile Heat Sinks for All Metal-Case Power Semiconductors

Footprint

Thermal Performance at Typical Load

Standard

Dimensions

Height

Mounting

Natural

Forced

Weight

P/N

in. (mm)

in. (mm)

Hole Pattern

Convection

Convection

lbs. (grams)

621A

4.750 (120.6) x 1.500 (38.1)

0.461 (11.7)

(1) TO-3

75°C @ 15W

2.0°C/W @ 250 LFM

0.1000 (45.36)

621K

4.750 (120.6) x 1.500 (38.1)

0.461 (11.7)

None

75°C @ 15W

2.0°C/W @ 250 LFM

0.1000 (45.36)

623A

4.750 (120.6) x 3.000 (76.2)

0.461 (11.7)

(1) TO-3

52°C @ 15W

1.5°C/W @ 250 LFM

0.2100 (95.26)

623K

4.750 (120.6) x 3.000 (76.2)

0.461 (11.7)

None

52°C @ 15W

1.5°C/W @ 250 LFM

0.210O (95.26)

A general purpose yet efficient heat dissipator for TO-3 and virtually all other styles of metal case

power semiconductor package types, the 621 and 623 Series low-profile flat back heat sinks find

a wide variety of applications. The central channel between fins measures 1.300 in. (33.0) (min.)

in width, accommodating many types of packages. Mounting hole pattern "A" is predrilled for the

standard TO-3 package. Material: Aluminum Alloy, Black Anodized.

TO-3

MECHANICAL

DIMENSIONS

621 AND 623 SERIES (EXTRUSION PROFILE 1327)

Dimensions: in. (mm)

NATURAL AND FORCED

CONVECTION CHARACTERISTICS

SEMICONDUCTOR MOUNTING HOLES

MECHANICAL

DIMENSIONS

302 AND 303 SERIES

301 SERIES

Dimensions: in. (mm)

NATURAL AND FORCED

CONVECTION CHARACTERISTICS

SEMICONDUCTOR MOUNTING HOLES

MECHANICAL

DIMENSIONS

641 SERIES

(EXTRUSION PROFILE 1371)

Dimensions: in. (mm)

NATURAL AND FORCED

CONVECTION CHARACTERISTICS

SEMICONDUCTOR MOUNTING HOLES

301/302/303 SERIES

Compact Heat Sinks for Dual Stud-Mounted Semiconductor Cases

Outline

Mounting

Thermal Performance at Typical Load

Standard

Dimensions

Length “A”

Hole (s)

Natural

Forced

Weight

P/N

in. (mm)

in. (mm)

Pattern and Number

Convection

Convection

lbs. (grams)

301K

2.000 (50.8) x 2.000 (50.8)

0.750 (19.1)

None

70°C @ 15W

2.5° C/W @ 250 LFM

0.0580 (26.31)

301M

2.000 (50.8) x 2.000 (50.8)

0.750 (19.1) (1) 10-32UNF, 0.625 in. thread depth

70° C @ 15W

2.5° C/W @ 250 LFM

0.0580 (26.31)

301N

2.000 (50.8) x 2.000 (50.8)

0.750 (19.1)

(1)

1⁄4 -28UNF, 0.625 in. thread depth

70° C @ 15W

2.5° C/W @ 250 LFM

0.0580 (26.31)

302M

2.000 (50.8) x 2.000 (50.8)

1.500 (38.1) (1) 10-32UNF, 0.625 in. thread depth

50° C @ 15W

1.8° C/W @ 250 LFM

0.1330 (60.33)

302MM

2.000 (50.8) x 2.000 (50.8)

1.500 (38.1) (2) 10-32UNF, 0.625 in. thread depth

50°C @ 15W

1.8°C/W @ 250 LFM

0.1330 (6033)

302N

2.000 (50.8) x 2.000 (50.8)

1.500 (38.1)

(1)

1⁄4 -28UNF, 0.625 in. thread depth

5O°C @ 15W

1.8° C/W @ 250 LFM

0.1330 (60.33)

302NN

2.000 (50.8) x 2.000 (50.8)

1.500 (38.1)

(2)

1⁄4 -28UNF, 0.625 in. thread depth

50°C @ 15W

1.8°C/W @ 250 LFM

0.1330 (60.33)

303M

2.000 (50.8) x 2.000 (50.8)

3.000 (76.2) (1) 10-32UNF, 0.625 in. thread depth

37° C @ 15W

1.3° C/W @ 250 LFM

0.2680 (121.56)

303MM

2.000 (50.8) x 2.000 (50.8)

3.000 (76.2) (2) 10-32UNF, 0.625 in. thread depth

37° C @ 15W

1.3° C/W @ 250 LFM

0.2680 (121.56)

303N

2.000 (50.8) x 2.000 (50.8)

3.000 (76.2) (1)

1⁄4 -28UNF, 0.625 in. thread depth

37° C @ 15W

1.3° C/W @ 250 LFM

0.2680 (121.56)

303NN

2.000 (50.8) x 2.000 (50.8)

3.000 (76.2) (2)

1⁄4 -28UNF, 0.625 in. thread depth

37° C @ 15W

1.3° C/W @ 250 LFM

0.2680 (121.56)

The large fin area in minimum total volume provided by the radial design of the 301/302/303

Series offers maximum heat transfer efficiency in natural convection. All types are available

with one tapped mounting hole for rectifiers and other stud-mounting semiconductors; the

302 and 303 Series offer maximum cost savings with dual mounting locations (“MM” and

“NN” mounting hole patterns) for two stud-mount devices. Material: Aluminum Alloy, Black

Anodized.

STUD-MOUNT

641 SERIES

Maximum Performance Natural Convection Heat Sink for all Metal-Case Semiconductors

Outline

Mounting

Thermal Performance at Typical Load

Standard

Dimensions

Height

Hole

Natural

Forced

Weight

P/N

in. (mm)

in. (mm)

Pattern

Convection

Convection

lbs. (grams)

641A

4.125 (104.8) x 3.000 (76.2)

1.000 (25.4)

(1) TO-3

36° C @ 15W

0.9° C/W @ 250 LFM

0.2900 (131.54)

641K

4.125 (104.8) x 3.000 (76.2)

1.000 (25.4)

None

36° C @ 15W

0.9° C/W @ 250 LFM

0.2900 (131.54)

Available with a standard TO-3 mounting hole pattern predrilled for cost-effective mounting in

limited-height applications, the 641 Series provides maximum performance in natural convec-

tion with an optimized heat sink surface area. The 641K type with an open channel area of

1.300 in. (33.0) and no predrilled mounting holes can be adapted to meet mounting require-

ments for most metal case power semiconductor types. Material: Aluminum Alloy, Black

Anodized.

TO-3

A

K

K

SERIES

301

302

303

M

A

K

N