www.ti.com

PACKAGE OUTLINE

C

32X

0.3

0.2

3.45 0.1

32X

0.5

0.3

1 MAX

(0.2) TYP

0.05

0.00

28X 0.5

2X

3.5

2X 3.5

A

5.1

4.9

B

5.1

4.9

(0.1)

VQFN - 1 mm max height

RHB0032E

PLASTIC QUAD FLATPACK - NO LEAD

4223442/B 08/2019

PIN 1 INDEX AREA

0.08 C

SEATING PLANE

1

8

17

24

9

16

32

25

(OPTIONAL)

PIN 1 ID

0.1

C A B

0.05

C

EXPOSED

THERMAL PAD

33

SYMM

SYMM

NOTES:

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing

per ASME Y14.5M.

2. This drawing is subject to change without notice.

3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance.

SCALE 3.000

SEE SIDE WALL

DETAIL

20.000

SIDE WALL DETAIL

OPTIONAL METAL THICKNESS