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TLV171, TLV2171, TLV4171

SBOS783 – SEPTEMBER 2016

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Product Folder Links: TLV171 TLV2171 TLV4171

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Copyright © 2016, Texas Instruments Incorporated

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

6.4 Thermal Information: TLV171

THERMAL METRIC(1)

TLV171

UNIT

D (SOIC)

DBV (SOT-23)

8 PINS

5 PINS

RθJA

Junction-to-ambient thermal resistance

149.5

245.8

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

97.9

133.9

°C/W

RθJB

Junction-to-board thermal resistance

87.7

83.6

°C/W

ψJT

Junction-to-top characterization parameter

35.5

18.2

°C/W

ψJB

Junction-to-board characterization parameter

89.5

83.1

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

—

—

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

6.5 Thermal Information: TLV2171

THERMAL METRIC(1)

TLV2171

UNIT

D (SOIC)

DGK (VSSOP)

8 PINS

8 PINS

RθJA

Junction-to-ambient thermal resistance

134.3

175.2

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

72.1

74.9

°C/W

RθJB

Junction-to-board thermal resistance

60.6

22.2

°C/W

ψJT

Junction-to-top characterization parameter

18.2

1.6

°C/W

ψJB

Junction-to-board characterization parameter

53.8

22.8

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

—

—

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

6.6 Thermal Information: TLV4171

THERMAL METRIC(1)

TLV4171

UNIT

D (SOIC)

PW (TSSOP)

14 PINS

14 PINS

RθJA

Junction-to-ambient thermal resistance

93.2

106.9

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

51.8

24.4

°C/W

RθJB

Junction-to-board thermal resistance

49.4

59.3

°C/W

ψJT

Junction-to-top characterization parameter

13.5

0.6

°C/W

ψJB

Junction-to-board characterization parameter

42.2

54.3

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

—

—

°C/W