6 Specifications

6.1 Absolute Maximum Ratings

over operating temperature range (unless otherwise noted)(1) (2)

MIN

MAX

UNIT

Voltage

VIN (for legacy chip only)

–0.3

24

V

VIN (for new chip only)

–0.3

30

Voltage

VOUT (for legacy chip only)

–0.3

5.0

V

Voltage

VOUT (for fixed output new chip only)

–0.3

2 × VOUT(typ)

or VIN + 0.3

or 5.5

(whichever is

lower)

V

Current

Peak output current

Internally limited

Temperature

Junction, TJ

–40

150

°C

Storage, Tstg

–65

150

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress

ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under

Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device

reliability.

(2)

All voltage values are with respect to network ground terminal.

6.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic discharge

Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1)

±2000

V

Charged device model (CDM), per JEDEC specification JESD22-C101, all pins(2)

±500

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

TLV704

SBVS148F – SEPTEMBER 2010 – REVISED MARCH 2023

www.ti.com

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