6.6 Typical Characteristics (continued)

at operating temperature TJ = 25°C, VIN = VOUT(NOM) + 1.0 V or 2.5 V (whichever is greater), IOUT = 1 mA, CIN = 1 µF, and

COUT = 1 µF (unless otherwise noted)

f - Frequency - Hz

1x101

1x102

1x103

1x104

1x105

1x106

1x107

0.001

0.002

0.005

0.01

0.02

0.05

0.1

0.2

0.5

1

2

5

10

20

20

Integrated Noise from

200Hz to 100KHz

1mA : 473

VRMS

50mA : 565

VRMS

1mA

50mA

Figure 6-19. Output Spectral Noise Density vs Frequency for

New Chip

V

= 4.0 V

V

= 3.0 V

C

= 10 F

T = +25 C

IN

OUT

OUT

J

m

°

I

= 50 mA

OUT

I

= 1 mA

OUT

100

90

80

70

60

50

40

30

20

10

0

10

100

1 k

10 k

100 k

1 M

10 M

Frequency (Hz)

Figure 6-20. Power-Supply Ripple Rejection vs Frequency for

Legacy Chip

f - Frequency (Hz)

1x101

1x102

1x103

1x104

1x105

1x106

1x107

0

10

20

30

40

50

60

70

80

90

100

VIN = 4.3V

VOUT = 3.3V

COUT = 10F

TJ = 25C

1mA

50mA

Figure 6-21. Power-Supply Ripple Rejection vs Frequency for

New Chip

Time (50 ms/div)

5.3

4.3

100

50

0

50

-

V

= 3.0 V

I

= 50 mA

C

= 10 F

IN

OUT

OUT

m

Figure 6-22. Line Transient Response for Legacy Chip

t - Time -

s

0

50

100 150 200 250 300 350 400 450 500

4

-300

4.5

-250

5

-200

5.5

-150

6

-100

6.5

-50

7

0

7.5

50

8

100

8.5

150

VOUT = 3.3V

IOUT = 50mA

COUT = 10F

dV/dt = 0.2V/

s

VIN

VOUT

Figure 6-23. Line Transient Response for New Chip

Time (0.5 ms/div)

100

50

0

200

0

200

-

V

= 4.0 V

V

= 3.0 V

C

= 10 F

IN

OUT

OUT

m

Figure 6-24. Load Transient Response for Legacy Chip

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TLV701

SBVS161A – NOVEMBER 2011 – REVISED APRIL 2023

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