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TLV3541IDBVT Datasheet(PDF) 6 Page - Texas Instruments

Part # TLV3541IDBVT
Description  TLV354x 200-MHz, Rail-to-Rail I/O, CMOS Operational Amplifiers for Cost-Sensitive Systems
PDF  45 Pages
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Manufacturer  TI2 [Texas Instruments]
Direct Link  https://www.ti.com
Logo TI2 - Texas Instruments

TLV3541IDBVT Datasheet(HTML) 6 Page - Texas Instruments

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TLV3541, TLV3542, TLV3544
SBOS756 – OCTOBER 2016
www.ti.com
Product Folder Links: TLV3541 TLV3542 TLV3544
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Copyright © 2016, Texas Instruments Incorporated
(1)
For more information about traditional and new thermal metrics, see Semiconductor and IC Package Thermal Metrics (SPRA953).
6.4 Thermal Information: TLV3541
THERMAL METRIC(1)
TLV3541
UNIT
D (SOIC)
DBV (SOT-23)
8 PINS
5 PINS
RθJA
Junction-to-ambient thermal resistance
123.8
216.3
°C/W
RθJC(top)
Junction-to-case (top) thermal resistance
68.7
84.3
°C/W
RθJB
Junction-to-board thermal resistance
64.5
43.1
°C/W
ψJT
Junction-to-top characterization parameter
23.0
3.8
°C/W
ψJB
Junction-to-board characterization parameter
64.0
42.3
°C/W
RθJC(bot)
Junction-to-case (bottom) thermal resistance
N/A
N/A
°C/W
(1)
For more information about traditional and new thermal metrics, see Semiconductor and IC Package Thermal Metrics (SPRA953).
6.5 Thermal Information: TLV3542
THERMAL METRIC(1)
TLV3542
UNIT
D (SOIC)
DGK (VSSOP)
8 PINS
8 PINS
RθJA
Junction-to-ambient thermal resistance
113.9
175.9
°C/W
RθJC(top)
Junction-to-case (top) thermal resistance
60.4
67.8
°C/W
RθJB
Junction-to-board thermal resistance
54.1
97.1
°C/W
ψJT
Junction-to-top characterization parameter
17.1
9.3
°C/W
ψJB
Junction-to-board characterization parameter
53.6
95.5
°C/W
RθJC(bot)
Junction-to-case (bottom) thermal resistance
N/A
N/A
°C/W
(1)
For more information about traditional and new thermal metrics, see Semiconductor and IC Package Thermal Metrics (SPRA953).
6.6 Thermal Information: TLV3544
THERMAL METRIC(1)
TLV3544
UNIT
D (SOIC)
PW (TSSOP)
14 PINS
14 PINS
RθJA
Junction-to-ambient thermal resistance
83.8
92.6
°C/W
RθJC(top)
Junction-to-case (top) thermal resistance
70.7
27.5
°C/W
RθJB
Junction-to-board thermal resistance
59.5
33.6
°C/W
ψJT
Junction-to-top characterization parameter
11.6
1.9
°C/W
ψJB
Junction-to-board characterization parameter
37.7
33.1
°C/W
RθJC(bot)
Junction-to-case (bottom) thermal resistance
N/A
N/A
°C/W



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