TLV61220

SLVSB53A – MAY 2012 – REVISED DECEMBER 2014

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8 Specifications

8.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

VIN

Input voltage on VBAT, SW, VOUT, EN, FB

–0.3

7.5

V

TJ

Operating junction temperature

–40

150

°C

Tstg

Storage temperature

–65

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

8.2 ESD Ratings

VALUE

UNIT

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

±2000

V(ESD)

Electrostatic discharge

V

Charged-device model (CDM), per JEDEC specification JESD22-

±1500

C101(2)

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

8.3 Recommended Operating Conditions

MIN

NOM

MAX

UNIT

VIN

Supply voltage at VIN

0.7

5.5

V

TA

Operating free air temperature range

–40

85

°C

TJ

Operating virtual junction temperature range

–40

125

°C

8.4 Thermal Information

TLV61220

THERMAL METRIC(1)

DBV

UNIT

6 PINS

RθJA

Junction-to-ambient thermal resistance

185.7

RθJC(top)

Junction-to-case (top) thermal resistance

124.3

RθJB

Junction-to-board thermal resistance

31.3

°C/W

ψJT

Junction-to-top characterization parameter

22.9

ψJB

Junction-to-board characterization parameter

30.8

RθJC(bot)

Junction-to-case (bottom) thermal resistance

N/A

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

4

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