5.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

VIN

Input voltage

1.5

6.0

V

VOUT

Output voltage

0.55

5.5

V

IOUT

Output current

0

500

mA

CIN

Input capacitor

1

µF

COUT

Output capacitor(1)

1

220

µF

VEN

Enable voltage(2)

0

6.0

V

fEN

Enable toggle frequency

10

kHz

TJ

Junction temperature

–40

125

°C

(1)

Minimum derated capacitance of 0.47 µF is required for stability.

(2)

If VEN > VIN, when VEN > VUVLO rising (min), the input pin (IN) must sink 1 mA of current to avoid the device being turn on with floating

input pin.

5.4 Thermal Information

THERMAL METRIC(1)

TLV758P

UNIT

DBV (SOT-23)

DRV (WSON)

5 PINS

6 PINS

RθJA

Junction-to-ambient thermal resistance

176.9

80.3

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

95.3

98.7

°C/W

RθJB

Junction-to-board thermal resistance

45.0

44.8

°C/W

ψJT

Junction-to-top characterization parameter

21.0

6.1

°C/W

ψJB

Junction-to-board characterization parameter

44.8

45.0

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

N/A

20.8

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

note.

www.ti.com

TLV758P

SBVS351D – APRIL 2018 – REVISED OCTOBER 2023

Copyright © 2023 Texas Instruments Incorporated

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