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STTH4R02SY Datasheet(PDF) 5 Page - STMicroelectronics |
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STTH4R02SY Datasheet(HTML) 5 Page - STMicroelectronics |
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5 / 14 page ![]() STTH4R02-Y Characteristics DocID17391 Rev 2 5/14 Figure 11: Dynamic parameters versus junction temperature Figure 12: Thermal resistance, junction to ambient, versus copper surface under tab Figure 13: Thermal resistance, junction to ambient, versus copper surface under each lead Figure 14: Thermal resistance, junction to ambient, versus copper surface under each lead 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 25 50 75 100 125 150 QRR; IRM [Tj] / QRR; IRM [Tj = 125 °C] IRM dlF/dt (A/µs) I F = 4 A V R = 160 V QRR 0 10 20 30 40 50 60 70 80 0 5 10 15 20 25 30 35 40 SCu(cm²) Rth(j-a) (°C/W) DPAK Epoxy printed board FR4, eCU= 35 µm 90 100 0 20 40 60 80 100 120 140 160 180 200 0 1 2 3 4 5 6 7 8 9 10 Rth(j-a)(°C/W) S CU(cm²) SMB Epoxy printed board FR4, copper thickness = 35 µm 0 20 40 60 80 100 120 140 160 0 1 2 3 4 5 6 7 8 9 10 Rth(j-a)(°C/W) S CU(cm²) SMC Epoxy printed board FR4, copper thickness = 35 µm |
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