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TPS720

SBVS100E – JUNE 2008 – REVISED SEPTEMBER 2015

www.ti.com

Product Folder Links: TPS720

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Copyright © 2008–2015, Texas Instruments Incorporated

12 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most

current data available for the designated devices. This data is subject to change without notice and revision of

this document. For browser-based versions of this data sheet, refer to the left-hand navigation.

12.1 Package Mounting

Solder pad footprint recommendations for the TPS720 are available from the Texas Instruments website at

www.ti.com.

Figure 34. YZU Wafer Chip-Scale Package Dimensions (in mm)