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EXAMPLE STENCIL DESIGN

16X (.063)

[1.6]

16X (.016 )

[0.41]

14X (.0250 )

[0.635]

(.213)

[5.4]

SSOP - 1.75 mm max height

DBQ0016A

SHRINK SMALL-OUTLINE PACKAGE

4214846/A 03/2014

NOTES: (continued)

8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate

design recommendations.

9. Board assembly site may have different recommendations for stencil design.

SOLDER PASTE EXAMPLE

BASED ON .005 INCH [0.127 MM] THICK STENCIL

SCALE:8X

SYMM

SYMM

1

8

9

16