TS5V330C

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SCDS276B – APRIL 2009 – REVISED DECEMBER 2009

PACKAGE THERMAL IMPEDANCE

over operating free-air temperature range (unless otherwise noted)

UNIT

D package(1)

73

DB package(1)

82

θJA

Package thermal impedance

DBQ package(1)

90

°C/W

PW package(1)

108

RGY package(2)

39

(1)

The package thermal impedance is calculated in accordance with JESD 51-7.

(2)

The package thermal impedance is calculated in accordance with JESD 51-5.

RECOMMENDED OPERATING CONDITIONS

(1)

MIN

MAX

UNIT

VCC

Supply voltage

4

5.5

V

VIH

High-level control input voltage (EN, IN)

2

5.5

V

VIL

Low-level control input voltage (EN, IN)

0

0.8

V

VANALOG

Analog input/output voltage

0

Vcc

V

TA

Operating free-air temperature

–40

85

°C

(1)

All unused control inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,

Implications of Slow or Floating CMOS Inputs, literature number SCBA004.

Copyright © 2009, Texas Instruments Incorporated

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