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LSF0108 Datasheet(PDF) 193 Page - Nexperia B.V. All rights reserved |
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LSF0108 Datasheet(HTML) 193 Page - Nexperia B.V. All rights reserved |
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193 / 234 page  193 Dimensions in mm DSN0603-2 (SOD962) DSN0603-2 (SOD962) Unit mm max nom min 0.32 0.28 0.0076 0.325 0.275 0.625 0.575 0.4 0.15 0.13 A(1) Dimensions Note 1. Dimension A is including coating foil thickness. 2. The marking bar indicates the cathode. A1 b 0.25 0.23 D E e1 L 0 0.5 mm scale A A1 E D (2) e1 L b 1 2 solder land solder resist solder land plus solder paste solder paste deposit Dimensions in mm R0.025 (8´) 0.12 (2´) 0.2 (2´) 0.22 (2´) 0.4 0.85 0.4 solder land solder resist solder land plus solder paste solder paste deposit Dimensions in mm R0.025 (8´) 0.12 (2´) 0.2 (2´) 0.22 (2´) 0.4 0.85 0.4 DSN1006-2 (SOD993) DSN1006-2 (SOD993) References Outline version European projection Issue date IEC JEDEC JEITA SOD993 sod993_po 14-10-24 14-10-24 Unit mm max nom min 0.30 0.03 0.65 1.05 0.65 A Dimensions (mm are the original dimensions) A1 b 0.51 0.55 0.95 0.49 D E e1 0 0.5 mm scale A A1 E D L L b b 1 2 0.26 0.24 L 0.24 (1) Note 1. The marking bar indicates the cathode. e1 occupied area solder paste solder resist solder lands Dimensions in mm 14-10-27 14-11-04 0.4 0.25 0.35 0.3 0.5 0.6 0.65 0.25 0.35 occupied area solder paste solder resist solder lands Dimensions in mm 14-10-27 14-11-04 0.4 0.25 0.35 0.3 0.5 0.6 0.65 0.25 0.35 DSN1006-2 (SOD993B) DSN1006-2 (SOD993B) Nexperia SOD992B silicon, leadless tiny package; 2 terminals; 0.28 mm pitch; 0.43 mm x 0.23 mm x 0.12 mm body 2. Package outline References Outline version European projection Issue date IEC JEDEC JEITA SOD992B - - - sod992b_po 18-08-21 18-08-22 Unit mm max nom min 0.14 0.46 0.15 0.22 0.28 0.43 0.40 A Dimensions (mm are the original dimensions) DSN0402B-2, leadless tiny package; 2 terminals SOD992B E D 0.26 0.11 0.18 0.20 L b e 0 0.5 mm scale A E D L L b (2x) 1 2 optional feature (polarity indicator) side view e 0.12 0.23 0.13 0.20 0.10 X detail X top view bottom view Fig. 1. Package outline DSN0402B (SOD992B) SOD992B All information provided in this document is subject to legal disclaimers. © Nexperia B.V. 2019. All rights reserved Package information 3 October 2019 2 / 5 Nexperia SOD993B DSN1006-2, leadless ultra small package; 2 terminals; body 1.0 x 0.6 x 0.27 mm 3. Soldering SOD993B sod993b_fr occupied area solder paste solder resist solder lands Dimensions in mm 18-11-14 18-11-19 0.5 0.6 0.8 0.25 0.2 R0.075 0.35 1.2 0.3 0.4 0.65 0.4 recommend stencil thickness: 0.1 mm Fig. 2. Reflow soldering footprint for DSN1006-2 (SOD993B) SOD993B All information provided in this document is subject to legal disclaimers. © Nexperia B.V. 2018. All rights reserved Package information 22 November 2018 3 / 5 Nexperia SOD993B DSN1006-2, leadless ultra small package; 2 terminals; body 1.0 x 0.6 x 0.27 mm 3. Soldering SOD993B sod993b_fr occupied area solder paste solder resist solder lands Dimensions in mm 18-11-14 18-11-19 0.5 0.6 0.8 0.25 0.2 R0.075 0.35 1.2 0.3 0.4 0.65 0.4 recommend stencil thickness: 0.1 mm Fig. 2. Reflow soldering footprint for DSN1006-2 (SOD993B) SOD993B All information provided in this document is subject to legal disclaimers. © Nexperia B.V. 2018. All rights reserved Package information 22 November 2018 3 / 5 DFN0603-2 (SOD972E) DFN0603-2 (SOD972E) Nexperia SOD972E plastic, ultra small and leadless full encapsulated package; 2 terminals; 0.4 mm pitch; 0.63 mm x 0.33 mm x 0.25 mm body 3. Soldering Footprint information for reflow soldering of ultra small and leadless encapsulated package; 2 terminals SOD972E sod972e_fr occupied area solder paste solder lands Dimensions in mm 18-04-27 18-05-09 0.19 0.47 0.28 0.28 0.75 0.85 0.3 0.4 solder resist 0.5 0.216 0.254 0.254 0.95 Fig. 2. Reflow soldering footprint for DFN0603-2 (SOD972E) SOD972E All information provided in this document is subject to legal disclaimers. © Nexperia B.V. 2018. All rights reserved Package information 23 May 2018 3 / 5 Nexperia SOD972E plastic, ultra small and leadless full encapsulated package; 2 terminals; 0.4 mm pitch; 0.63 mm x 0.33 mm x 0.25 mm body 2. Package outline References Outline version European projection Issue date IEC JEDEC JEITA SOD972E - - - sod972e_po 18-04-16 18-05-09 Unit mm max nom min 0.275 0.03 0.15 0.4 A Dimensions (mm are the original dimensions) Indication of Cathode DFN0603-2, ultra small and leadless encapsulated package; 2 terminals; body 0.63 x 0.33 x 0.25 mm SOD972E A1 b 0.25 0.13 0.23 e 0.655 E 0.355 0.605 0.305 D L 0 0.5 mm scale A A1 E D 0.225 Note 1. The marking bar indicates the cathode. (1) b (2x) L (2x) 1 2 top View OPTIONAL FEATURE (polarity indicator) e1 bottom view side view detail X X Fig. 1. Package outline DFN0603-2 (SOD972E) SOD972E All information provided in this document is subject to legal disclaimers. © Nexperia B.V. 2018. All rights reserved Package information 23 May 2018 2 / 5 Nexperia SOD972E plastic, ultra small and leadless full encapsulated package; 2 terminals; 0.4 mm pitch; 0.63 mm x 0.33 mm x 0.25 mm body 2. Package outline References Outline version European projection Issue date IEC JEDEC JEITA SOD972E - - - sod972e_po 18-04-16 18-05-09 Unit mm max nom min 0.275 0.03 0.15 0.4 A Dimensions (mm are the original dimensions) Indication of Cathode DFN0603-2, ultra small and leadless encapsulated package; 2 terminals; body 0.63 x 0.33 x 0.25 mm SOD972E A1 b 0.25 0.13 0.23 e 0.655 E 0.355 0.605 0.305 D L 0 0.5 mm scale A A1 E D 0.225 Note 1. The marking bar indicates the cathode. (1) b (2x) L (2x) 1 2 top View OPTIONAL FEATURE (polarity indicator) e1 bottom view side view detail X X Fig. 1. Package outline DFN0603-2 (SOD972E) SOD972E All information provided in this document is subject to legal disclaimers. © Nexperia B.V. 2018. All rights reserved Package information 23 May 2018 2 / 5 Nexperia SOD972E plastic, ultra small and leadless full encapsulated package; 2 terminals; 0.4 mm pitch; 0.63 mm x 0.33 mm x 0.25 mm body 3. Soldering Footprint information for reflow soldering of ultra small and leadless encapsulated package; 2 terminals SOD972E sod972e_fr occupied area solder paste solder lands Dimensions in mm 18-04-27 18-05-09 0.19 0.47 0.28 0.28 0.75 0.85 0.3 0.4 solder resist 0.5 0.216 0.254 0.254 0.95 Fig. 2. Reflow soldering footprint for DFN0603-2 (SOD972E) SOD972E All information provided in this document is subject to legal disclaimers. © Nexperia B.V. 2018. All rights reserved Package information 23 May 2018 3 / 5 Minimized outline drawings and reflow soldering footprint 2-pin SMD packages |
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