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LSF0108 Datasheet(PDF) 195 Page - Nexperia B.V. All rights reserved |
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LSF0108 Datasheet(HTML) 195 Page - Nexperia B.V. All rights reserved |
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195 / 234 page  195 DFN1608D-2 (SOD1608) DFN1608D-2 (SOD1608) Nexperia SOD964 silicon, leadless very small package; 2 terminals; 0.6 mm pitch; 1.6 mm x 0.8 mm x 0.29 mm body 2. Package outline References Outline version European projection Issue date IEC JEDEC JEITA SOD964 sod964_po 15-08-13 16-01-03 Unit mm max nom min 0.31 0.03 0.85 1.65 0.6 0.285 A Dimensions (mm are the original dimensions) Indication of Cathode DSN1608-2, leadless very small package; 2 terminals; body 1.6 x 0.8 x 0.29 mm SOD964 A1 b 0.71 0.75 1.55 0.69 D 0.46 b2 0.645 0.44 0.625 b1 E e1 0 1 mm scale A A1 E D L1 L L2 b1 b (2x) b2 1 2 e2 0.31 0.29 L 0.94 0.92 L1 0.36 0.34 L2 0.27 Note 1. The marking bar indicates the cathode. e1 e2 (1) Fig. 1. Package outline DSN1608-2 (SOD964) SOD964 All information provided in this document is subject to legal disclaimers. © Nexperia B.V. 2018. All rights reserved Package information 19 September 2018 2 / 5 DSN1608-2 (SOD964) DSN1608-2 (SOD964) Nexperia SOD964 silicon, leadless very small package; 2 terminals; 0.6 mm pitch; 1.6 mm x 0.8 mm x 0.29 mm body 3. Soldering SOD964 sod964_fr occupied area solder paste solder resist Cu trace Dimensions in mm 16-10-26 17-03-29 0.885 0.93 0.27 0.3 1.8 2 0.7 1.2 R = 0.075 mm Fig. 2. Reflow soldering footprint for DSN1608-2 (SOD964) SOD964 All information provided in this document is subject to legal disclaimers. © Nexperia B.V. 2018. All rights reserved Package information 19 September 2018 3 / 5 Nexperia SOD964 silicon, leadless very small package; 2 terminals; 0.6 mm pitch; 1.6 mm x 0.8 mm x 0.29 mm body 3. Soldering SOD964 sod964_fr occupied area solder paste solder resist Cu trace Dimensions in mm 16-10-26 17-03-29 0.885 0.93 0.27 0.3 1.8 2 0.7 1.2 R = 0.075 mm Fig. 2. Reflow soldering footprint for DSN1608-2 (SOD964) SOD964 All information provided in this document is subject to legal disclaimers. © Nexperia B.V. 2018. All rights reserved Package information 19 September 2018 3 / 5 2-pin SMD packages Minimized outline drawings and reflow soldering footprint Dimensions in mm Images are for reference only, for detailed drawings please visit nexperia.com/packages SC-90 (SOD323F) SC-90 (SOD323F) 0.95 1.65 2.2 2.1 3.05 solder lands solder resist occupied area solder paste Dimensions in mm 0.5 (2´) 0.6 (2´) 0.6 (2´) 0.5 (2´) 0.95 1.65 2.2 2.1 3.05 solder lands solder resist occupied area solder paste Dimensions in mm 0.5 (2´) 0.6 (2´) 0.6 (2´) 0.5 (2´) SOD323 SOD323 0.95 1.65 2.2 2.1 3.05 solder lands solder resist occupied area solder paste 0.5 (2´) 0.6 (2´) 0.6 (2´) 0.5 (2´) sod323_fr Dimensions in mm |
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