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OPA392DBVT Datasheet(PDF) 7 Page - Texas Instruments

Part # OPA392DBVT
Description  OPAx392 Precision, Low-Offset-Voltage, Low-Noise, Low-Input-Bias-Current, Rail-to-Rail I/O, e-trim™ Operational Amplifiers
PDF  61 Pages
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Manufacturer  TI2 [Texas Instruments]
Direct Link  https://www.ti.com
Logo TI2 - Texas Instruments

OPA392DBVT Datasheet(HTML) 7 Page - Texas Instruments

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6.4 Thermal Information OPA392
THERMAL METRIC(1)
OPA392
UNIT
DBV (SOT-23)
DCK (SC70)
YBJ (DSBGA)
5 PINS
5 PINS
6 PINS
RθJA
Junction-to-ambient thermal resistance
187.1
220.8
135.0
°C/W
RθJC(top)
Junction-to-case (top) thermal resistance
107.4
124.4
1.1
°C/W
RθJB
Junction-to-board thermal resistance
57.5
72.9
38.8
°C/W
ΨJT
Junction-to-top characterization parameter
33.5
46.1
0.4
°C/W
ΨJB
Junction-to-board characterization parameter
57.1
72.6
38.8
°C/W
RθJC(bot)
Junction-to-case (bottom) thermal resistance
N/A
N/A
N/A
°C/W
(1)
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
6.5 Thermal Information OPA2392
THERMAL METRIC(1)
OPA2392
UNIT
D (SOIC)
DGK (VSSOP)
DSG (WSON)
YBJ (DSBGA)
8 PINS
8 PINS
8 PINS
9 PINS
RθJA
Junction-to-ambient thermal resistance
131.7
165
70.9
110.7
°C/W
RθJC(top)
Junction-to-case (top) thermal
resistance
71.4
53
88.3
0.7
°C/W
RθJB
Junction-to-board thermal resistance
75.2
87
37.5
32.1
°C/W
ΨJT
Junction-to-top characterization
parameter
21.8
4.9
2.9
0.3
°C/W
ΨJB
Junction-to-board characterization
parameter
74.4
85
37.5
32.1
°C/W
RθJC(bot)
Junction-to-case (bottom) thermal
resistance
N/A
N/A
12.8
N/A
°C/W
(1)
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
6.6 Thermal Information OPA4392
THERMAL METRIC(1)
OPA4392
UNIT
PW (TSSOP)
14 PINS
RθJA
Junction-to-ambient thermal resistance
109.6
°C/W
RθJC(top)
Junction-to-case (top) thermal resistance
27.4
°C/W
RθJB
Junction-to-board thermal resistance
56.1
°C/W
ΨJT
Junction-to-top characterization parameter
1.5
°C/W
ΨJB
Junction-to-board characterization parameter
54.9
°C/W
RθJC(bot)
Junction-to-case (bottom) thermal resistance
N/A
°C/W
(1)
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
www.ti.com
OPA392, OPA2392, OPA4392
SBOS926I – JANUARY 2021 – REVISED MARCH 2025
Copyright © 2025 Texas Instruments Incorporated
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Product Folder Links: OPA392 OPA2392 OPA4392



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