EVB71111

868/915MHz Receiver

Evaluation Board Description

39012 71111 01

Page 13 of 14

EVB Description

Rev. 011

June/07

5

Package Description

The device TH71111 is RoHS compliant.

Fig. 2:

LQFP32 (Low profile Quad Flat Package)

All Dimension in mm, coplanaríty < 0.1mm

E1, D1

E, D

A

A1

A2

e

b

c

L

α

min

1.40

0.05

1.35

0.30

0.09

0.45

0°

max

7.00

9.00

1.60

0.15

1.45

0.8

0.45

0.20

0.75

7°

All Dimension in inch, coplanaríty < 0.004”

min

0.055

0.002

0.053

0.012

0.0035

0.018

0°

max

0.276

0.354

0.063

0.006

0.057

0.031

0.018

0.0079

0.030

7°

5.1

Soldering Information

•

The device TH71111 is qualified for MSL3 with soldering peak temperature 260 deg C

according to JEDEC J-STD-2.

1

32

25

17

24

8

9

16

D

D1

E1

e

b

E

A2

A

A1

L

c

0.25

(0.0098)

+

+

.10 (.004)