RF2722 datasheet(26/26 Pages) RFMD

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RF2722

Proposed

Rev A4 DS050919

7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical

support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com.

Thermal Pad and Via Design

The PCB land pattern has been designed with a thermal pad that matches the exposed die paddle size on the bottom of the

device.

Thermal vias are required in the PCB layout to effectively conduct heat away from the package. The via pattern shown has been

designed to address thermal, power dissipation and electrical requirements of the device as well as accommodating routing

strategies.

The via pattern used for the RFMD qualification is based on thru-hole vias with 0.203mm to 0.330mm finished hole size on a

0.5mm to 1.2mm grid pattern with 0.025mm plating on via walls. If micro vias are used in a design, it is suggested that the

quantity of vias be increased by a 4:1 ratio to achieve similar results.

Via

0.203 - 0.330 (mm)

Finished Hole

0.5 - 1.2 (mm) Grid

Figure 3. Thermal Pad and Via Design (RFMD Qualification)

RF2722 Datasheet(PDF) 26 Page - RF Micro Devices