9 Device and Documentation Support

9.1 Documentation Support

9.1.1 Related Documentation

For related documentation, see the following:

• Texas Instruments, Application Design Guidelines for LM324/LM358 Devices application note

9.2 Receiving Notification of Documentation Updates

To receive notification of documentation updates, navigate to the device product folder on ti.com. Click on

Notifications to register and receive a weekly digest of any product information that has changed. For change

details, review the revision history included in any revised document.

9.3 Support Resources

TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight

from the experts. Search existing answers or ask your own question to get the quick design help you need.

Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do

not necessarily reflect TI's views; see TI's Terms of Use.

9.4 Trademarks

TI E2E™ is a trademark of Texas Instruments.

All trademarks are the property of their respective owners.

9.5 Electrostatic Discharge Caution

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled

with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may

be more susceptible to damage because very small parametric changes could cause the device not to meet its published

specifications.

9.6 Glossary

TI Glossary

This glossary lists and explains terms, acronyms, and definitions.

10 Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from Revision H (October 2023) to Revision I (November 2024)

Page

• Changed the status of the LM2902B-Q1 and LM2902BA-Q1 SOIC-14 package from: preview to: active ........1

Changes from Revision G (February 2023) to Revision H (October 2023)

Page

• Changed the format of Package Information table to include package lead size and channel count................ 1

• Changed the status of the LM2902BA-Q1 TSSOP-14 package from: preview to: active ..................................1

Changes from Revision F (May 2022) to Revision G (February 2023)

Page

• Deleted the preview note for the LM2902B-Q1 TSSOP-14 package in the Device Information table................1

• Changed the LM2902B-Q1 values in the Thermal Information section..............................................................5

• Added Typical Characteristics curves for LM2902B-Q1 and LM2902BA-Q1................................................... 10

LM2902-Q1, LM2902B-Q1, LM2902BA-Q1

SGLS178I – AUGUST 2003 – REVISED NOVEMBER 2024

www.ti.com

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Product Folder Links: LM2902-Q1 LM2902B-Q1 LM2902BA-Q1