5.3 Thermal Information

THERMAL METRIC(1)

TMUX28xx

UNIT

DSG

8 PINS

RθJA

Junction-to-ambient thermal resistance

70

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

85

°C/W

RθJB

Junction-to-board thermal resistance

36

°C/W

ΨJT

Junction-to-top characterization parameter

4.0

°C/W

ΨJB

Junction-to-board characterization parameter

36

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

15

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

note.

5.4 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

VDD

Positive power supply voltage

1.8

5.5

V

VS or VD

Signal path input/output voltage (source or drain pin) (Sx, D)

-5.5

5.5

V

VSEL or VEN

Address or enable pin voltage

0

5.5

V

IS or ID (CONT) Source or drain continuous current (Sx, D)

IDC (1)

A

TA

Ambient temperature

–40

125

°C

(1)

Refer to Source or Drain Continuous Current table for IDC specifications.

5.5 Source or Drain Continuous Current

VDD = 3.3V, GND = 0V (unless otherwise noted)

CONTINUOUS CURRENT PER CHANNEL (IDC)(1)

PACKAGE

25°C

85°C

125°C

UNIT

DSG

1.1

0.87

0.27

A

(1)

Refer to Total power dissipation (Ptot) limits in Absolute Maximum Ratings table that must be followed with max continuous current

specification.

5.6 Source or Drain RMS Current

VDD = 3.3V, GND = 0V (unless otherwise noted)

RMS CURRENT PER CHANNEL (IRMS)(1)

PACKAGE

25°C

85°C

125°C

UNIT

DSG

1.1

1.1

0.54

A

(1)

Refer to Total power dissipation (Ptot) limits in Absolute Maximum Ratings table that must be followed with max RMS current

specification.

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SCDS488 – DECEMBER 2025

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